Thermal microscopy CTRM750 For imaging temperature

Non-contact, non-destructive

The system performs fully non-contact, non-destructive analysis, ensuring the sample surface remains intact with no need for any sample preparation.

Easy to operate

The dedicated software provides intuitive and streamlined control of all confocal functions through an easy-to-use interface.

Flexible configuration

Designed with an open-architecture modular platform, the system can be easily integrated with a wide range of complementary systems. 

Reliable data

The system has been used by researchers and cited in scientific publications, demonstrating its reliability as a microscopy platform.

CTRM750 : Confocal microscope module integrated with TRM250 optics

Features & Benefits

• High-resolution non-destructive optical 3D measurement
•  Real-time confocal imaging
• Various optical zoom
• Inclination compensation
• Easy analysis mode
• Precise and reliable high-speed height measurement
• Inspection of features through semi-transparent substrate
• Dedicated probe station with multi-axis stages
• Thermoreflectance image with various wavelengths of the light source
• Dedicated high-speed heating/cooling device
• Transient thermal analysis imaging
• Customizing setup available
• No sample preparation

Powerful optical performance of Confocal module

With powerful and unique performance of CTRM750, the application area of optical microscope imaging is
enlarged. The image of the features under the transparent or semi-transparent layers can be clearly inspected, and
the surface image of light-emitting or highly-heated materials can be distinctly monitored, which are not possible
with the conventional optical microscope technology. CTRM750 confocal module is widely proven as a final and
successful optical solution in the various application fields.

Intuitive profile analysis

Cutting surface: Profile measurement (50x) 

Roughness analysis

Film surface: Roughness measurement (50x) 

Application fields of Confocal module

CTRM750 confocal module is a promising solution for the measurement of height, width, angle, area, and volume of micro and submicron structures such as: 

• Semiconductor – IC pattern, bump height, wire loop height, defect inspection, CMP process
• FPD product – Touch panel screen inspection, ITO pattern, LCD column spacer height
• MEMS device – 3D profile of structure, surface roughness, MEMS pattern
• Glass surfaces – Thin film solar cell, solar cell texture, laser pattern
• Materials research – Tooling surface inspection, roughness, crack analysis

TRM module of CTRM750

The thermoreflectance imaging module of CTRM750 is commercialized for analyzing thermal images after introducing thermal reflection imaging technology developed by domestic research institutes.
It uses a high-sensitivity optical microscope to measure the distribution of light reflectance on the surface of a sample or a specific surface as the temperature changes to obtain thermal image information, and provides excellent thermal image resolution.
It is a new technology that can observe the thermal distribution state of the sample with sub-micron spatial resolution, which cannot be obtained by traditional thermal imaging methods, and will become a new analytical tool for thermal analysis of microelectronic circuits.

Principle of Thermal Microscope Imaging

Thermoreflectance microscope is based on the physical phenomenon that the optical reflectance of the sample changes with the temperature of the measured sample, and the technology of calculating the surface temperature of the sample by measuring the optical reflectance. It enables high-resolution micro-thermography of microscopic areas, which is not available with traditional thermal imaging techniques such as infrared imaging.

Wavelength dependence of Thermo-reflectance coefficient

Application fields

With the refinement and high integration of semiconductor and display components, the spatial resolution of thermal imaging microscopes based on existing infrared thermal imaging has reached its performance limit in the application of measurement and analysis of heat distribution of micro components.
In various applications that require thermal analysis, the CTRM750 provides high spatial resolution of thermal imaging that cannot be achieved by traditional methods, thereby providing a new alternative solution for thermal distribution measurement and analysis.

Thermoelectric heating vacuum plate

Getting the target sample's reference images at specific temperatures is necessary to interpret the thermo reflectance image to the actual temperature information.
For this purpose, the thermoelectric heating vacuum plate is provided with CTRM750. It uses a Peltier device and cooling fin structure for fast and accurate temperature control, and the software controls the heating/cooling temperature.
In the center of the heating plate is a hole for vacuum suction, which fixes the target sample by vacuum. A temperature sensor is embedded in the heating plate to monitor the temperature.

Transient thermal imaging

The reflectivity change at specific instances can be measured accurately by precise and timely control of the pulsed light source and imaging devices. It provides information on how temperature changes with time. This transient thermal response is a unique characteristic available by the thermoreflectance microscope.

Specifications

* Note 1: 100 times measurement of standard sample (1 μm step height) with 100X / 0.7 objective
* Note 2: 100 times measurement of standard sample (5 μm pitch) with 100X/ 0.7 objective

Dimensions