TESCAN EXLO™: Ex Situ Lift-Out for Scalable, High-Throughput TEM Specimen Preparation

Scale your semiconductor workflows with fast, dependable ex situ lift-out

Tescan EXLO™ streamlines ex situ lift-out with a motorized XYZR manipulator, parfocal zoom optics, and intuitive software. It supports samples up to 50 mm, coordinate import/export, and optional upgrades. Increase throughput and cut specimen costs with full compatibility across multiple FIBs and TEM AutoPrep Pro™.

Key benefits

  • Reduce the cost per TEM specimen
  • Maximize FIB-SEM utilization
  • Increase lab efficiency
  • Ensure high-quality, reproducible TEM results across high specimen volumes
  • Assure specimen stability and attachment reliability
  • Ensure the integrity of air-sensitive and cryo-prepared specimens