University of Sydney and Tescan demonstrate how plasma FIB-SEM delivers both high-volume 3D characterization and precise TEM specimen preparation in a single universal system.
Meet the speakers:
Mr. Felix Theska (University of Sydney): Senior Technical Officer at Sydney Microscopy & Microanalysis, University of Sydney, supports researchers in specimen preparation for atom probe tomography and transmission electron microscopy using Ga+, Xe+, and Ar+ FIB-SEM systems.
Martin Sláma (TESCAN): Product Marketing Manager for FIB-SEM 3D characterization and TEM lamella preparation at Tescan, brings eight years of experience with plasma FIB and Ga+ FIB-SEM solutions for materials characterization.
Webinar description:
Modern materials research demands both high-throughput characterization and damage-minimized TEM sample preparation with high reproducibility. The Tescan AMBER X 2 with Mistral™ plasma FIB technology addresses both requirements in one system.
This webinar demonstrates how plasma FIB-SEM now delivers artifact-free TEM lamellae preparation alongside large-scale volume analysis. You'll see real applications and workflows that showcase this dual capability.
Webinar highlist:
-
Optimized plasma FIB profiles for artifact-free TEM specimen preparation
-
Real-world case studies from University of Sydney workflows
-
AMBER X 2 performance in precision and versatility applications
Tescan AMBER X with iFIB+™ control and real-time SE signal end.

English (UK)
日本語 (Japan)
한국어 (Korean)
Tiếng Việt
中文 (Chinese)