How does MAGNA differ from MIRA XR/CLARA?

MAGNA combines TriLens™ + Triglav™ for stable low-kV UHR imaging, adds STEM at 30 keV, and streamlines EDS/EBSD/WDS analytics.

Is it suitable for charge-sensitive samples?

Yes. MultiVac™ 7–500 Pa mitigates charging and often avoids conductive coating.

Does it support advanced analytics?

Yes. It integrates EDS, EBSD and WDS in a field-free analytical configuration.

TESCAN MAGNA – Ultra-High-Resolution FE-SEM with TriLens™ embedded optics

TESCAN MAGNA – Ultra-High-Resolution UHR SEM with TriLens™ Immersion Optics

Introduction to TESCAN MAGNA
Typical Applications
Key Features
Typical Technical Specifications
Frequently Asked Questions (FAQ)
Overview of TESCAN MAGNA
Video / Webinar related
Contact & Support

Introduction to TESCAN MAGNA

MAGNA redefines UHR imaging with a TriLens™ electron-optical design combining ultra-short working distance with exceptional signal detection. It enables seamless switching between UHR and analytical modes, ensuring both highest resolution and high beam currents for spectroscopy and 3D microanalysis.

Typical Applications

Characterization of nanostructured and 2D materials
Semiconductor failure analysis and process development
High-resolution surface morphology and cross-section imaging
Correlative microscopy and in-situ experiments at low kV

Key Features

TriLens™ Immersion Optics with Triglav™ Column

Provides < 0.8 nm resolution at 15 kV and 1.4 nm at 1 kV.
Immersion lens enhances signal-to-noise for surface and sub-surface features.
Supports STEM in SEM mode up to 30 keV.

In-Flight Beam Tracing™ & Advanced Automation

Dynamic beam simulation for real-time focus and stigmator adjustment.
In-Flight™ Auto Focus, Auto Contrast/Brightness, Auto Stigmators.
Stable long-term performance for unattended imaging and analysis.

MultiVac™ Variable Pressure Operation

Seamless transition between high-vacuum and low-vacuum (7–500 Pa) modes.
Ideal for non-conductive or environmentally sensitive samples.
Integrated pressure and beam control for optimal charge compensation.

TESCAN Essence™ Software Platform

Unified interface for SEM imaging and EDS/EBSD/WDS analysis.
Customizable layouts, multi-user accounts, undo/redo, multi-window live display.
SharkSEM engine for fast acquisition and remote operation support.

Typical Technical Specifications

Specification	Value (reference)
Electron source	Schottky field emitter
Resolution	0.8 nm @ 15 kV (SE), 1.4 nm @ 1 kV (In-Beam SE)
Accelerating voltage	200 eV – 30 keV
Probe current	1 pA – 400 nA (continuous)
Magnification	1× – 1,000,000×
Vacuum mode	High vacuum / MultiVac™ 7–500 Pa
Detectors (example)	SE (E-T), In-Beam SE/BSE, BSE, STEM, CL (optional)
Analytical options	EDS, EBSD, WDS (fully integrated)

*Specifications may vary depending on configuration and installed options.

Frequently Asked Questions (FAQ)

What is the TriLens™ optical system?
It’s an immersion-lens design combining three lens elements to deliver UHR performance and flexible beam control for analytical applications.

Can MAGNA be used for non-conductive samples?
Yes, via the MultiVac™ mode (7–500 Pa) for variable-pressure operation and charge neutralization.

What detectors are available?
SE (E-T), In-Beam SE/BSE, BSE, STEM and CL options, plus full EDS/EBSD/WDS integration.

What software does MAGNA use?
The TESCAN Essence™ platform for SEM control and analytical integration with custom layouts and remote support.

Overview of TESCAN MAGNA

TESCAN MAGNA combines UHR imaging capability and analytical integration within a stable FEG-SEM platform, designed for maximum productivity and the highest level of detail in materials and semiconductor research.