TESCAN MIRA – High-Resolution Analytical SEM with Integrated Essence™ EDS

Introduction to TESCAN MIRA
Typical Applications
Key Features
Representative Technical Specifications
FAQ
Overview of TESCAN MIRA
Related Video / Webinar
Contact & Support

Introduction to TESCAN MIRA

MIRA features TESCAN’s unique aperture-less optics with an additional Intermediate Lens™ that maintains a small probe size even at higher beam currents, enabling seamless switching between imaging and analytical conditions with a single click. Wide Field Optics™ provides a live SEM overview for intuitive navigation at magnifications as low as 2×, while Essence™ multi-user software streamlines operation for all skill levels.

Typical Applications

Metals & Alloys: microstructure/phase contrast, failure surfaces, EBSD/EDS workflows.
Particles & Powders: topography and size at low kV; nano-/sub-micron features.
Geoscience: petrography, CL imaging, mineral phase mapping with BSE + EDS.
Micro-/Electronics: wafer and device inspection, contamination/defect analysis.
Beam-sensitive/Charging samples: SingleVac™ as standard; optional MultiVac for variable pressure.

Key Features

Integrated Imaging & Analytics

Essence™ EDS (optional): live spectral, map, line profiles directly in the SEM window; results stored with stage position.
One-click switch between imaging (low beam current) and analytical (high beam current) conditions.

Intermediate Lens™ & In-Flight Beam Tracing™

Optimizes spot size across beam currents; delivers the precise landing current specified by the operator.
Improves SNR and keeps resolution at analytical conditions.

Wide Field Optics™ Navigation

Live SEM overview at 2× magnification with extended depth-of-focus; no separate optical camera needed.
Accurate navigation on tilted/EBSD holders with scanning-tilt correction.

SingleVac™ & MultiVac (optional)

SingleVac™ factory-preset low vacuum makes observing charging samples possible without coating.
MultiVac (1–700 Pa) with GSD enables efficient topographic imaging of insulating/outgassing materials.

Optional In-Column Detection & BDT

In-column SE/BSE detectors for simultaneous multi-signal acquisition (up to 4 channels).
Beam Deceleration Technology (BDT) enhances low-kV resolution.

Representative Technical Specifications

Specification	Value (representative)
Electron source	High-brightness Schottky FEG
Resolution (HV)	1.2 nm @ 30 keV (SE); 1.0 nm @ 30 keV (In-Beam SE); 3.5 nm @ 1 keV (In-Beam SE); 1.8 nm @ 1 keV (BDT*)
Accelerating voltage	200 eV – 30 keV (< 50 eV with BDT option*)
Probe current	2 pA – 400 nA (continuously adjustable)
Vacuum modes	High Vacuum; SingleVac™ (preset); MultiVac* (1–700 Pa)
Magnification	2× – 1,000,000×
Software	TESCAN Essence™ (multi-user GUI, 3D Collision Model, optional Image Snapper, scripting)

*Optional detectors/features. Specifications may vary depending on configuration and installed options.

FAQ

How does MIRA speed analytical work?
Optional fully integrated Essence™ EDS combines imaging and elemental analysis in one live window and stores results with stage position.

Can it handle charging/beam-sensitive samples?
Yes. SingleVac™ is standard; MultiVac (1–700 Pa) with GSD enables efficient low-vacuum imaging without metal coating.

Is MIRA expandable?
Yes. Modular platform supports in-column SE/BSE, CL, R-STEM, EBSD, WDS, Raman (RISE™), and more.

Overview of TESCAN MIRA

TESCAN MIRA provides a fast, consistent, and intuitive path to high-quality SEM and compositional data. Intermediate Lens™, In-Flight Beam Tracing™, Wide Field Optics™, and optional Essence™ EDS work together to deliver robust imaging and analytics for QA/QC, failure analysis, and R&D.