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Introduction to TESCAN MIRA XR
MIRA XR builds on a refined BrightBeam™ column with combined electrostatic–magnetic optics to deliver high resolution at both low- and high-kV while sustaining analytical probe currents. The streamlined detection system enables fast SE/BSE imaging; with optional retractable BSE (including low-energy BSE), the system provides rich compositional contrast for everyday and advanced workflows.
Typical Applications
- QA/QC & manufacturing: routine inspection, failure analysis, process monitoring.
- Metals, alloys & coatings: porosity, grain size, microstructure; rapid EDS verification.
- Particles & powders: morphology and size analysis at low/high kV.
- Geoscience & cement: petrography, phase mapping, automated mineralogy workflows.
- General R&D: high-resolution imaging with integrated compositional analysis.
Key Features
In-Flight™ Automation & Throughput
- In-Flight™ Beam Tracing™ with automatic brightness/contrast, fine centering and auto stigmators reduces re-alignment time and maintains optimal focus across probe currents.
- One-click switching between imaging (low current) and analytical (high current) conditions without mechanical realignment.
Integrated Dual Essence™ EDS
- Fully integrated EDS (spectra, maps, line scans) inside the live SEM window; results linked to stage coordinates.
- Continuous operation under analytical conditions with maintained SNR and resolution.
Wide Field Optics™ Navigation
- Live SEM overview down to 2× magnification with exceptional depth of focus — no separate optical camera required.
- Accurate navigation on pre-tilted/EBSD holders via scanning-tilt correction.
MultiVac™ for Challenging Samples
- High-vacuum imaging for maximum spatial resolution; MultiVac™ 7–500 Pa for non-conductive or beam-sensitive materials.
- Optimized charge neutralization and detector compatibility in variable pressure.
Essence™ Software & Safety
- Modular, intuitive UI (search, presets, multi-user layouts, Undo/Redo, multi-channel live display).
- Essence™ 3D Collision model visualizes chamber geometry and predicts stage/accessory motion to help protect retractable detectors.
Representative Technical Specifications
| Specification | Value (representative) |
|---|---|
| Electron source | Schottky field emission gun (FEG) |
| Electron beam landing energy | 50 eV – 30 keV (below 50 eV with sample bias / BDT*) |
| Probe current | Up to 400 nA (continuously adjustable) |
| Resolution (high vacuum) | 0.8 nm @ 30 keV (STEM*), ~0.9 nm @ 30 keV (SE), 1.4 nm @ 1 keV with sample bias (BDT*), 1.7 nm @ 0.5 keV |
| Resolution (low vacuum)* | 1.5 nm @ 30 keV with GSD*, 3.0 nm @ 3 keV with GSD* |
| Magnification | 2× – 2,000,000× |
| Vacuum modes | High vacuum (<1×10−3 Pa); MultiVac™ 7 – 500 Pa* |
| Detectors (examples) | SE (E-T), axial/in-column SE/BSE*, retractable 4Q BSE*, low-energy BSE*, GSD* (MultiVac™), CL*, STEM* |
| Integrated analysis | Dual Essence™ EDS (maps, spectra, lines); EBSD*, WDS* |
*Optional and configuration-dependent features. Specifications may vary depending on configuration and installed options.
FAQ
How does MIRA XR reduce re-alignment time?
With In-Flight™ automation (Beam Tracing™, auto B/C, fine centering, auto stigmators) that keeps the column optimized as you change probe current or conditions.
Is an optical camera required for navigation?
No. Wide Field Optics™ provides a live SEM overview down to 2× magnification for intuitive sample navigation.
Can MIRA XR handle non-conductive samples?
Yes. MultiVac™ (7–500 Pa) supports variable-pressure operation with compatible detectors and charge mitigation.
Overview of TESCAN MIRA XR
TESCAN MIRA XR unites UHR imaging, integrated compositional analysis and automation in a single FE-SEM platform engineered for throughput, stability and reproducibility across multi-user environments.
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