FIB-SEM Microscopy Introduction to Semicon FA and R&D

The continuous drive for miniaturization, efficiency, and integration in semiconductor devices is pushing boundaries in both design and manufacturing. As a result, the challenges faced by researchers and engineers in failure analysis (FA) and sample preparation are more complex than ever.
For professionals working in this space, having reliable and efficient tools to prepare and analyze samples is critical to maintaining progress. This is why we invite you to our upcoming webinar to explore our suite of FIB-SEM solutions, designed specifically for semiconductor FA and R&D laboratories.
In this online session, we’ll be walking through the role these systems play in sample preparation workflows, highlighting how precision, automation, and ease of use can boost your lab’s productivity.

Title: FIB-SEM Microscopy Introduction to Semicon FA and R&D

Status: Recorded Video is available for reviewing

Why This Webinar is Relevant for You

If you’re working with advanced semiconductor devices, you’re no stranger to the growing complexity of failure analysis. The industry’s shift toward 3D integration, high-density packaging, and increased functionality demands a level of analysis that conventional techniques can’t always provide. TESCAN’s solutions are engineered to meet these demands head-on.

During this session, we’ll explore how our Gallium and Xenon FIB-SEM platforms streamline processes such as sample cross-sectioning, TEM preparation, and delayering. More specifically, we’ll dive into the correlative use of laser and FIB technologies, the role of AI in automating TEM sample preparation, and how to enhance precision during localized delayering with in-situ nanoprobing.

Whether you’re managing large sample volumes or tackling advanced packaging investigations, this webinar will equip you with insights that you can directly apply to your lab’s daily operations.

Key Takeaways for Semiconductor Professionals

The upcoming webinar will offer a deep dive into several critical processes and solutions for FA and R&D labs. Here’s what you can expect:

Optimized Workflow for Advanced Packaging Investigations: Learn how combining laser systems with TESCAN’s FIB-SEM platforms, particularly the SOLARIS X 2, can streamline your analysis of complex semiconductor packages.

AI-Driven Automation in TEM Sample Preparation: Discover how TESCAN’s systems integrate AI to automate precise, repeatable TEM sample preparation on both Gallium and Xenon FIB systems, enhancing productivity while maintaining high-quality results.

Localized Planar Delayering with In-Situ Nanoprobing: Explore how the AMBER X 2 system facilitates delayering and in-situ probing, offering unparalleled accuracy in investigating defects within logic and memory devices.

Maximizing Throughput and Precision: Understand how our FIB-SEM solutions are tailored to meet the increasing demands for precision and efficiency in failure analysis, ensuring your lab stays competitive.

Why You Shouldn’t Miss This Opportunity

As semiconductor devices evolve, so must the tools we use to analyze them. If you’re looking for ways to enhance your lab’s capabilities, improve sample throughput, or simply stay informed on the latest approaches in semiconductor failure analysis, this webinar is for you.

Sign up today to secure your spot and take the opportunity to engage with experts who will share best practices, real-world applications, and strategies for tackling the most challenging aspects of semiconductor failure analysis.