TESCAN CLARA – Field-Free Ultra-High-Resolution SEM with BrightBeam™ Technology

TESCAN CLARA – Field-Free Ultra-High-Resolution SEM with BrightBeam™ Technology


 

Introduction to TESCAN CLARA

The TESCAN CLARA features TESCAN’s BrightBeam™ SEM column that employs a combined electrostatic–magnetic objective lens for field-free ultra-high-resolution imaging at low beam energies. This unique optical design reduces aberrations and minimizes charging artifacts, ensuring outstanding performance for all sample types — conductive, non-conductive, and beam-sensitive alike.


 

Typical Applications

  • Nanomaterials & catalysts: nanoparticles, coatings, nanofibers, and porous structures.
  • Metals & alloys: microstructure analysis, grain boundary studies, EBSD/EDS mapping.
  • Beam-sensitive or insulating materials: stable low-kV imaging with optional MultiVac™.
  • Biological samples: low-vacuum or cryo observation of cells, tissues, and microorganisms.
  • Geological samples: mineral morphology, elemental mapping, and cathodoluminescence.

 

Key Features

BrightBeam™ Field-Free Column

  • Combined electrostatic–magnetic objective ensures field-free imaging and reduced aberrations at low beam energies.
  • Ultra-high resolution down to 0.9 nm @ 15 keV and 1.2 nm @ 1 keV (BDT).

Selective Multi-Detector System

  • Dual in-column detectors (Axial & Multidetector) plus Everhart-Thornley (E-T) for simultaneous SE/BSE collection.
  • Energy- and angle-filtered BSE imaging for optimized topographic and compositional contrast.

MultiVac™ Variable Pressure Mode

  • Operates between 7–500 Pa (N₂/H₂O) for charge mitigation in insulating or outgassing samples.
  • Includes Gaseous Secondary Electron Detector (GSD) for beam-sensitive materials.

In-Flight™ Automation & Essence™ Software

  • Automatic focus, stigmation, brightness/contrast, and beam tracing for fast, stable imaging.
  • Essence™ GUI with modular design, guided workflows, and real-time 3D collision model.

Optional Integrated Tools

  • ONCam optical navigation camera, RISE™ Raman, tensile/heating stages, or Serial Block Face Imaging (SBFI).

 

Representative Technical Specifications

ParameterSpecification
Electron source Schottky field emission gun
Resolution (HV) 0.9 nm @ 15 keV • 1.2 nm @ 1 keV (BDT)
Accelerating voltage 50 eV – 30 keV
Probe current 2 pA – 400 nA (continuous)
Vacuum modes High vacuum <1×10⁻³ Pa; MultiVac™ 7–500 Pa
Magnification 2× – 2,000,000×
Stage (5-axis) X–Y: 130 mm, Z: 100 mm, Tilt: -70° to +90°, Rotation: 360°
Software TESCAN Essence™ (SharkSEM™, Image Snapper, etc.)

*Specifications may vary depending on installed options and configuration.


 

FAQ

What makes CLARA different from other SEMs?
CLARA offers field-free UHR imaging using the BrightBeam™ column with dual in-column detection and optional MultiVac™, ideal for diverse materials.

Can it image beam-sensitive or non-conductive samples?
Yes, MultiVac™ enables imaging under low-vacuum conditions (7–500 Pa) with charge compensation.

Does CLARA support analytical tools?
Yes, it is fully compatible with EDS, EBSD, WDS, and optional Raman or SBFI modules.


 

Overview of TESCAN CLARA

TESCAN CLARA combines field-free BrightBeam™ optics, selective signal detection, and advanced automation to deliver fast, accurate, and reproducible nanoscale imaging for materials, biological, and geological research. It empowers users to achieve high-resolution, high-contrast results from any sample type.


 

Related Video/Webinar

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Contact & Support

M TECHNOLOGY CO., LTD

VAT code: 0311014975

No 8 Road N8, Mega Ruby Khang Dien, Long Truong Ward, Hochiminh City, 700000, Vietnam.
The North Branch: Floor 1st, CT5 Building, Cat Tuong TNT Apartment, Le Thai To Street,
Vo Cuong Ward, Bac Ninh Province, Vietnam
Phone: +84 28 6288 9639 - +84988.248.156 (Mr Thương)
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.

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