TESCAN AutoSlicer™

TESCAN AutoSlicer™ - Robust and reliable semi-automated TEM sample preparation

Key Benefits:

• Prepare high quality, ultra-thin TEM samples from sub-10 nm semiconductor technology nodes in less than one hour using advanced dedicated workflows provided by optimized TESCAN Ga FIB-SEM platform

• Improve sample preparation throughput with fully automated TEM lamella preparation to the undercut in the trench followed by a guided workflow for semiautomated attachment of the lamella to the TEM grid

• Retain flexibility for advanced TEM lamella preparation thanks to our nanomanipulator in the “below FIB” position, which allows preparation of top-down, planar and inverted lamella geometries without need of a flipping device

• Obtain robust, predictable results on large variety of samples using adjustable reference marks that best suit the sample and its structure

• Develop custom workflows unique to the samples processed in your lab. User-defined parameters for the automated TEM sample and crosssection preparation can be saved as guided workflows to help assure all samples meet the quality requirements for the type of analysis

• Perform multi-site, unattended TEM sample preparation from multiple areas of interest with TESCAN AutoSlicer`s option to specify an array of lamellae at different locations and from multiple samples, preparing all samples in a single batch operation

• TESCAN AutoSlicer™ is compatible with all TESCAN Ga and Plasma FIB-SEM instruments
  
  

Applications:

• Prepare ultra-thin TEM lamellae, with the minimum amorphous damage from 10 nm FinFET devices

• High-throughput cross-sectioning, analysis and sample preparation for logic, memory, RF/power compound semiconductors (GaN/SiC) and many other types of semiconductor devices