TESCAN SOLARIS 2 – Next-Generation Ga FIB-SEM for Advanced Nanofabrication and 3D Analysis

Q: What distinguishes SOLARIS 2 from previous Ga FIB-SEM systems?

SOLARIS 2 features TruBeam™ ion optics and Essence™ automation, delivering superior beam control, higher milling precision and fully automated workflows for TEM and 3D applications.

Q: Can SOLARIS 2 prepare TEM lamellae automatically?

Yes. Auto FIB recipes automate trenching, lift-out, thinning and final polishing to produce high-quality lamellae with minimal user input.

Q: How does SOLARIS 2 ensure stability for long patterning sessions?

TruBeam™ optics dynamically compensates for charge build-up and drift, maintaining consistent focus and milling accuracy during extended runs.

Q: Does SOLARIS 2 support 3D FIB-SEM tomography?

Yes. Automated serial FIB slicing synchronized with SEM imaging enables 3D reconstruction and quantitative volume analysis at the nanoscale.

Q: Can SOLARIS 2 be integrated with analytical and correlative tools?

Yes. It supports EDS, EBSD, WDS, CL and STEM-in-SEM, as well as cryo and Raman modules for multi-modal correlative workflows.

Introduction to TESCAN SOLARIS 2
Typical Applications
Key Features
Representative Technical Specifications
FAQ
Overview of TESCAN SOLARIS 2
Related Video / Webinar
Contact & Support

Introduction to TESCAN SOLARIS 2

TESCAN SOLARIS 2 is a state-of-the-art Ga⁺ FIB-SEM platform designed for precision nanofabrication, high-resolution imaging, and 3D analysis across a wide range of semiconductor and materials-science applications. Its Gallium Liquid Metal Ion Source (LMIS) and TruBeam™ ion optics enable high-stability, precise milling and patterning. The Schottky FEG SEM column with Intermediate Lens™ and In-Flight Beam Tracing™ provides stable analytical imaging. Unified Essence™ software delivers automation, scripting, and correlative workflows for efficient sample preparation and analysis.

Typical Applications

Semiconductor R&D and FA: site-specific cross-sections, device modification, TEM lamella prep, and circuit probing.
Nanotechnology & materials research: nano-patterning, defect isolation, and 3D tomography with high precision.
TEM sample preparation: automated trenching, lift-out, thinning and final polishing with minimal damage.
Failure analysis & packaging: delamination, via/TSV inspection, and void/interface evaluation.
Correlative & in-situ studies: integration with cryo-transfer, Raman, CL, or STEM detectors for multi-modal analysis.

Key Features

High-Precision Gallium Ion Beam

Gallium LMIS provides a finely focused beam for accurate milling, nano-patterning and TEM sample preparation.
Beam current range from sub-pA to > 50 nA covers delicate polishing to high-speed trenching.
Optimized beam shape ensures smooth, artifact-free surfaces even at low currents.

TruBeam™ Ion Optics

Enhanced beam stability and reduced aberrations for long-duration nano-machining.
Dynamic charge compensation minimizes drift and redeposition during complex patterning.

Advanced Electron Optics

Schottky FEG SEM column with Intermediate Lens™ and In-Flight Beam Tracing™ ensures stable resolution across probe currents.
High-contrast SE/BSE imaging supports precise end-point detection and structural characterization.

Automation and TESCAN Essence™

Unified SEM/FIB control with recipe editor and scripting interface.
TESCAN Auto FIB automates lamella prep, serial sectioning and 3D workflows.

3D Tomography and Correlative Imaging

Serial FIB slicing synchronized with SEM imaging for accurate 3D reconstruction.
Compatible with third-party visualization tools for volume rendering and analysis.

Flexible Analytical Integration

Supports EDS, EBSD, WDS, CL and STEM-in-SEM.
Cryo, nanomanipulation and in-situ heating extend experiment capabilities.

Representative Technical Specifications

Specification	Value (representative)
Ion source	Gallium Liquid Metal Ion Source (LMIS)
Ion beam energy	1 – 30 keV
Ion beam current range	sub-pA – > 50 nA
SEM electron source	High-brightness Schottky FEG
SEM accelerating voltage	200 eV – 30 keV
SEM resolution	1.2 nm @ 30 keV (SE); 3.5 nm @ 1 keV (In-Beam SE)
Ion beam resolution	< 15 nm @ 30 keV
Vacuum modes	High Vacuum; Variable Pressure (1–700 Pa)
Detectors (standard)	SE, BSE, In-Beam SE/BSE, STEM-in-SEM; optional EDS, EBSD, CL
Software platform	TESCAN Essence™ with Auto FIB, recipe editor and scripting

*Specifications may vary depending on configuration and installed options.

FAQ

What distinguishes SOLARIS 2 from previous Ga FIB-SEM systems?
SOLARIS 2 features new TruBeam™ optics and Essence™ automation, offering superior beam control, higher precision and fully automated TEM and 3D workflows.

Can SOLARIS 2 prepare TEM lamellae automatically?
Yes. Auto FIB recipes automate trenching, lift-out, thinning and final polishing, producing high-quality lamellae with minimal user input.

How does SOLARIS 2 ensure stability for long patterning sessions?
TruBeam™ optics dynamically compensate for charge build-up and drift, maintaining consistent focus and accuracy over time.

Does SOLARIS 2 support 3D FIB-SEM tomography?
Yes. Automated serial slicing with SEM imaging enables 3D reconstruction and quantitative volume analysis at the nanoscale.

Can SOLARIS 2 be integrated with analytical and correlative tools?
Yes. It supports EDS, EBSD, WDS, CL and STEM-in-SEM, as well as cryo and Raman modules for multi-modal workflows.

Overview of TESCAN SOLARIS 2

TESCAN SOLARIS 2 combines Ga⁺ FIB precision with advanced SEM optics and Essence™ automation, streamlining TEM sample preparation, 3D tomography and nano-machining for semiconductors and materials research. It sets a new standard for accuracy, reliability and productivity in dual-beam nanoscience systems.