TESCAN SOLARIS X 2 – Xe Plasma FIB-SEM for High-Throughput Nano-Machining and Ga-Free 3D

Q: What makes SOLARIS X 2 different from Ga FIB systems?

The Xenon plasma source delivers far higher milling rates and Ga-free sample preparation, ideal for advanced packaging and large-volume 3D applications.

Q: Can SOLARIS X 2 perform fully automated 3D tomography?

Yes. TruSlice™ 3D coordinates serial sectioning and SEM imaging to produce accurate, drift-corrected volumes.

Q: Is SOLARIS X 2 suitable for Ga-free TEM sample preparation?

Yes. Xe plasma milling supports fast trenching and high-quality final surfaces without Ga implantation.

Q: How is beam stability maintained during long milling sessions?

The Mistral™ column and optimized ion optics stabilize beam shape and current for uniform milling over extended runs.

Q: Does SOLARIS X 2 support analytical and correlative workflows?

Yes. It integrates EDS, EBSD, WDS, CL and STEM-in-SEM, and is compatible with cryo, CLEM and in-situ stages.

Introduction to TESCAN SOLARIS X 2
Typical Applications
Key Features
Representative Technical Specifications
FAQ
Overview of TESCAN SOLARIS X 2
Related Video / Webinar
Contact & Support

Introduction to TESCAN SOLARIS X 2

TESCAN SOLARIS X 2 is a Xe plasma FIB-SEM platform engineered for high-throughput nano-machining, Ga-free TEM sample preparation, and large-volume 3D analysis. With the Mistral™ plasma column and Triglav™ UHR SEM optics, it provides fast, uniform milling and stable, high-contrast imaging at low kV. Essence™ software unifies SEM/FIB control, automation, and TruSlice™ 3D tomography for consistent results across extended workflows.

Typical Applications

Semiconductor FA & packaging: large cross-sections, TSV/die-stack exposure, delamination and void inspection.
Ga-free TEM preparation: rapid trenching, lift-out, thinning and final polish without ion contamination.
Advanced materials: large-area trenching, interface studies and microstructure mapping.
Additive manufacturing & metallurgy: porosity and layer-wise evaluation, 3D reconstruction of printed parts.
Life science & geoscience: high-contrast 3D imaging of porous/biological samples at low beam damage.

Key Features

High-Throughput Xe Plasma Ion Beam

Xenon plasma ion source enables removal rates far beyond Ga FIB for fast bulk mill and large volumes.
Stable beam at high currents supports uniform trenching and clean surfaces for tomography or TEM prep.
Low contamination pathways suitable for Ga-free workflows.

Mistral™ Plasma Column & Dual-Beam Geometry

Optimized column design for precise ion–electron coincidence at working tilt.
Uniform sputtering performance across current setpoints with reduced redeposition.

Triglav™ UHR SEM Optics

Schottky FEG with three-lens Triglav™ optics delivers sub-nanometer resolution and stable contrast at low kV.
Wide field and depth of focus simplify navigation over large or complex samples.

Essence™ Automation & TruSlice™ 3D Tomography

Unified SEM/FIB control with recipe editor, macros and scripting for unattended runs.
TruSlice™ 3D synchronizes serial sectioning and imaging for accurate volume reconstruction.

Analytical & Correlative Integration

Supports EDS, EBSD, WDS, CL, STEM-in-SEM and cryo-correlative options.
Compatible with nanomanipulation and in-situ stages for dynamic experiments.

Flexible Vacuum & Sample Environment

High-vacuum operation for clean analytics; variable pressure (1–700 Pa) for charging/porous materials.
Spacious chamber with multi-port layout for detectors and automation accessories.

Representative Technical Specifications

Specification	Value (representative)
Ion source	Xenon plasma ion source
Ion beam energy	1 – 30 keV
Ion beam current range	1 nA – > 2 µA
SEM electron source	High-brightness Schottky FEG
SEM accelerating voltage	200 eV – 30 keV
SEM resolution	1.2 nm @ 30 keV (SE); 3.5 nm @ 1 keV (In-Beam SE)
Ion beam resolution	< 20 nm @ 30 keV
Vacuum modes	High Vacuum; Variable Pressure (1 – 700 Pa)
Detectors (standard)	SE, BSE, STEM-in-SEM, ion BSE; optional EDS, EBSD, WDS, CL
Software platform	TESCAN Essence™ with TruSlice™ 3D, automation and scripting

*Specifications may vary depending on configuration and installed options.

FAQ

What makes SOLARIS X 2 different from Ga FIB systems?
The Xenon plasma source delivers far higher milling rates and Ga-free sample preparation, ideal for advanced packaging and large-volume 3D applications.

Can SOLARIS X 2 perform fully automated 3D tomography?
Yes. TruSlice™ 3D coordinates serial sectioning and SEM imaging to produce accurate, drift-corrected volumes.

Is SOLARIS X 2 suitable for Ga-free TEM sample preparation?
Yes. Xe plasma milling supports fast trenching and high-quality final surfaces without Ga implantation.

How is beam stability maintained during long milling sessions?
The Mistral™ column and optimized ion optics stabilize beam shape and current for uniform milling over extended runs.

Does SOLARIS X 2 support analytical and correlative workflows?
Yes. It integrates EDS, EBSD, WDS, CL and STEM-in-SEM, and is compatible with cryo, CLEM and in-situ stages.

Overview of TESCAN SOLARIS X 2

TESCAN SOLARIS X 2 unites high-throughput Xe plasma milling with Triglav™ UHR SEM imaging and Essence™ automation. It accelerates time-to-data for failure analysis, semiconductor engineering and materials research while ensuring Ga-free preparation and reliable 3D results.