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Introduction to TESCAN VEGA
VEGA simplifies day-to-day analytical work through TESCAN’s aperture-less optics and Intermediate Lens™, enabling seamless switching between imaging and analytical conditions with a single click. Wide Field Optics™ provides a live SEM overview at magnifications as low as 2× for intuitive navigation across large samples, while the multi-user Essence™ interface—with a real-time 3D Collision Model—supports safe operation for users of all skill levels.
Typical Applications
- Metals & alloys: QA/QC and failure analysis; porosity, grain size, and microstructure studies (BSE + optional EDS).
- Particles & powders: morphology and size; coated or uncoated materials in HV or low-vac modes.
- Geoscience: petrography and mineral phase mapping; complementary CL options for structural/compositional variation.
- Micro-/electronics: device inspection, cross-sections, solder joints; live EDS maps and line profiles (optional).
- Life sciences: uncoated, beam-sensitive/charging samples using SingleVac™ or optional MultiVac™ + GSD.
Key Features
Integrated Imaging & Analytics
- Essence™ EDS (optional): spectrum, maps, and line profiles directly in the live SEM window; data linked to stage coordinates.
- One-click switch between low-current imaging and high-current analytical conditions—no mechanical re-alignment.
Intermediate Lens™ & In-Flight Beam Tracing™
- Optimizes probe size across beam currents; achieves the landing current specified by the operator.
- Maintains SNR and resolution under analytical conditions.
Wide Field Optics™ Navigation
- Live SEM overview at 2× with exceptional depth-of-focus; no optical navigation camera required.
- Accurate navigation on pre-tilted/EBSD holders with scanning-tilt correction.
Low-Vacuum Capability
- SingleVac™ (standard): factory-preset low vacuum enables observation of charging samples without metal coating.
- MultiVac™ (optional, 7–500 Pa, N₂/H₂O): includes GSD for efficient topographic imaging of insulating/outgassing materials.
Ease of Use & Safety
- Guided workflows, presets, Undo/Redo, quick search; multi-user layouts in Essence™.
- Essence™ 3D Collision Model for real-time interference prevention with chamber-mounted detectors and accessories.
Representative Technical Specifications
| Specification | Value (representative) |
|---|---|
| Electron source | Heated tungsten filament cathode |
| Resolution (HV) | 3 nm @ 30 keV (SE); 8 nm @ 3 keV (SE) |
| Resolution (LV) | 3.5 nm @ 30 keV (BSE/GSD*) |
| Accelerating voltage | 200 eV – 30 keV |
| Probe current | 1 pA – 2 µA (continuously adjustable) |
| Vacuum modes | High Vacuum; SingleVac™ (preset); MultiVac™* 7–500 Pa (N₂/H₂O) |
| Magnification | 2× – 1,000,000× |
| Software | TESCAN Essence™ (multi-user GUI, presets, 3D Collision Model; optional Image Snapper, scripting) |
*Optional detectors/features. Specifications may vary depending on configuration and installed options.
FAQ
How does VEGA streamline analytical workflows?
Optional fully integrated Essence™ EDS provides spectra, maps and line profiles directly in the live SEM window; all results are stored with stage positions for easy revisit.
Can VEGA image charging or beam-sensitive samples?
Yes. SingleVac™ is standard for uncoated charging samples; MultiVac™ (7–500 Pa) with GSD enhances topographic imaging of insulating/outgassing materials.
Is VEGA expandable?
Yes. The modular platform supports a wide range of detectors (SE/BSE options, CL) and third-party EDS/EBSD/WDS, plus Raman (RISE™).
Overview of TESCAN VEGA
TESCAN VEGA delivers an intuitive, fast, and repeatable path to high-quality morphological and compositional data. Wide Field Optics™, Intermediate Lens™ with In-Flight Beam Tracing™, and optional Essence™ EDS work together to boost imaging quality and speed analytical work for QA/QC, failure analysis, and R&D.
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