Một giải pháp thay thế để tiếp cận với TEM lamella bán tự động chất lượng cao
- Low-kV ultra-high-resolution imaging of high-end semiconductor devices
- Precise end-pointing at low electron beam energies
- Gentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performance
- Optimized workflows and recipes for easy preparation of ultra-thin TEM lamellae
- Semi-automated software module for site-specific TEM lamella preparation
- Preparation of advanced geometry TEM lamellae from the most advanced semiconductor nodes
- Specialized, load-lock-compatible stage carousel for TEM sample preparation
- Dedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation
Multiple-site TEM sample preparation
Inverted lamella geometry
HR-TEM image of a “gate-cut” TEM lamella prepared from a 10 nm technology node
Yêu cầu báo giá - SEM TESCAN
