Nền tảng FIB SEM plasma cho phép nghiên cứu mặt ngang sâu, độ phân giải điểm cuối cao, phục vụ nghiên cứu phân tích lỗi giai đoạn đóng gói

TESCAN SOLARIS X
  • Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
  • Prepare large area FIB-cross-sections up to 1 mm wide
  • Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
  • Live SEM-monitoring during FIB milling for precise end-pointing
  • Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
  • Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
  • Essence™ easy-to-use modular user interface

Cross-section of a TSV array

Cross-section of a sensor MEMS device

STEM-BF image of an 80 nm thick TEM lamella from a 65 nm DRAM node

Yêu cầu báo giá - SEM TESCAN

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