Nền tảng FIB SEM plasma được tối ưu hóa phục vụ quá trình nghiên cứu chế tạo các thiết bị bán dẫn hiện đại nhất với hóa chất độc quyền

TESCAN AMBER X
  • Low-kV high-resolution imaging with enhanced topographic contrast of target layers
  • Imaging of edges of delayered or cleaved chips using field-free high-resolution technology
  • Dedicated and proprietary gas chemistries for sub-14 nm nodes deprocessing
  • End-pointing software module for semiautomated deprocessing enables stopping the process at a desired layer
  • Electrical characterization of the most sensitive semiconductor devices using in-situ nanoprobing
  • Easy-to-use, fully customizable, applicationoriented and modular user interface

TCL layer, Intel 14 nm Skylake

Overview of a 100 μm × 100 μm delayered window on a 10 nm technology node

Nanoprobing a delayered 10 nm technology node

Yêu cầu báo giá - SEM TESCAN

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